INTERNATIONAL PATENT: CAMELOT ELECTRONICS TECHNOLOGY CO., LTD., 金禄电子科技股份有限公司 FILES APPLICATION FOR "HIGH-DENSITY INTERCONNECT VIA CHAIN TEST BOARD AND MANUFACTURING METHOD THEREFOR"

Posted On: 2026-01-11

GENEVA, Jan. 11 -- CAMELOT ELECTRONICS TECHNOLOGY CO., LTD. (No.M1-04 and 05A, YingFu Industrial Area Anfeng Industrial Park, High-Tech Development ZoneQingyuan, Guangdong 511500), 金禄电子科技股份有限公司 (中国广东省清远市高新技术开发区安丰工业园盈富工业区M1-04,05A号地) filed a patent application (PCT/CN2024/132227) for "HIGH-DENSITY INTERCONNECT VIA CHAIN TEST BOARD AND MANUFACTURING METHOD THEREFOR" on Nov 15, 2024. With publication no. WO/2026/007301, the details related to the patent application was publis...

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INTERNATIONAL PATENT: CAMELOT ELECTRONICS TECHNOLOGY CO., LTD., 金禄电子科技股份有限公司 FILES APPLICATION FOR "HIGH-DENSITY INTERCONNECT VIA CHAIN TEST BOARD AND MANUFACTURING METHOD THEREFOR"