GENEVA, Feb. 18 -- BOTTS, Jerold L. (2912 Oberlin AveOrlando, Florida 32804) filed a patent application (PCT/US2024/040946) for "ELECTRONIC CURING ASSEMBLY AND RELATED METHOD" on Aug 05, 2024. With publication no. WO/2025/034649, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): BOTTS, Jerold L. (2912 Oberlin AveOrlando, Florida 32804)
Abstract:
An electronic curing assembly is for relining a pipe with a first opening and second opening opposite the first opening. The electronic curing assembly includes a bladder tube to...