GENEVA, March 31 -- BOSTIK SA (51, Esplanade du General de Gaulle92800 Puteaux - La Defense) filed a patent application (PCT/FR2024/051209) for "MULTI-LAYER STRUCTURE" on Sep 16, 2024. With publication no. WO/2025/062091, the details related to the patent application was published on Mar 27, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ROBERT, Christophe (BOSTIK SAZAC du bois de Plaisance,101 rue du Champ Cailloux60280 VENETTE), PUTHANPARAMBIL, Deepa (BOSTIK, INC.5220 Blazer ParkwayDUBLIN, Ohio 43017), XU, Yuewen (BOSTIK, INC.11320 Watertown Plank RoadWAUWATOSA, Wisconsin 53226), BIRONEAU...