GENEVA, March 31 -- BOSTIK SA (420 rue d'Estienne d'Orves92700 COLOMBES) filed a patent application (PCT/EP2024/075747) for "HOT-MELT PRESSURE SENSITIVE ADHESIVE COMPOSITION" on Sep 16, 2024. With publication no. WO/2025/061602, the details related to the patent application was published on Mar 27, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ZENG, Di (BOSTIK (SHANGHAI) MANAGEMENT CO.LTDBuilding 1, No.968 Guanghua RoadMinhang DistrictSHANGHAI, Shanghai 201108), ZHANG, Jingying (BOSTIK (SHANGHAI) MANAGEMENT CO.LTDBuilding 1, No.968 Guanghua RoadMinhang DistrictSHANGHAI, Shanghai 201108), L...