INTERNATIONAL PATENT: BOSTIK SA FILES APPLICATION FOR "A REACTIVE HOT MELT ADHESIVE COMPOSITION, AN ARTICLE COMPRISING THE SAME AND USE THEREOF"

GENEVA, March 9 -- BOSTIK SA (420 rue d'Estienne d'Orves92700 COLOMBES) filed a patent application (PCT/EP2024/073799) for "A REACTIVE HOT MELT ADHESIVE COMPOSITION, AN ARTICLE COMPRISING THE SAME AND USE THEREOF" on Aug 26, 2024. With publication no. WO/2025/045811, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MA, Xiaowei (BOSTIK (SHANGHAI) MANAGEMENT CO. LTDBuilding 1, No.968 Guanghua Road,Minhang DistrictSHANGHAI, Shanghai 201108), WEI, Jiangong (BOSTIK (SHANGHAI) MANAGEMENT CO. LTDBuilding 1, No.968 Guanghua Road,M...