INTERNATIONAL PATENT: BOSTIK SA FILES APPLICATION FOR "A HOT-MELT ADHESIVE COMPOSITION, USE THEREOF AND AN ARTICLE COMPRISING THE SAME"

GENEVA, July 14 -- BOSTIK SA (51 Esplanade du General de GaulleLa Defense92800 Puteaux) filed a patent application (PCT/EP2024/086491) for "A HOT-MELT ADHESIVE COMPOSITION, USE THEREOF AND AN ARTICLE COMPRISING THE SAME" on Dec 16, 2024. With publication no. WO/2025/146341, the details related to the patent application was published on Jul 10, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YANG, Huaxiao (Bostik (Shanghai) Management Co., Ltd Building INdeg968 Guanghua Road, MinhangDistrictShanghai, Shanghai 201108)

Abstract: The invention relates to a hot-melt adhesive composition compri...