INTERNATIONAL PATENT: BOSTIK SA FILES APPLICATION FOR "A HOT MELT ADHESIVE COMPOSITION, ARTICLE COMPRISING THE SAME AND USE THEREOF"

GENEVA, May 27 -- BOSTIK SA (51 Esplanade du General de GaulleLa Defense92800 Puteaux) filed a patent application (PCT/EP2024/081949) for "A HOT MELT ADHESIVE COMPOSITION, ARTICLE COMPRISING THE SAME AND USE THEREOF" on Nov 12, 2024. With publication no. WO/2025/103978, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LI, Yong (SHANGHAI (BOSTIK) - HEAD OFFICE Building 1, No.968 Guanghua Road Minhang DistrictShanghai, Shanghai 201108), WEI, Jiangong (BOSTIK MANAGEMENT CO. LTD Building 1, No.968 Guanghua Road Minhang Distric...