GENEVA, March 10 -- BONDTECH CO., LTD. (77, Kisshoin-ishiharanishi-machi, Minami-ku, Kyoto-shi, Kyoto6018366), ボンドテック株式会社 (京都府京都市南区吉祥院石原西町７７) filed a patent application (PCT/JP2024/030408) for "METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK, AND ELECTROSTATIC CHUCK" on Aug 27, 2024. With publication no. WO/2025/047709, the details related to the patent application was published on Mar 06, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organi...