GENEVA, Nov. 24 -- BONDTECH CO., LTD. (25, Kisshoin-Miyanohigashi-cho, Minami-ku, Kyoto-shi, Kyoto6018305), ボンドテック株式会社 (京都府京都市南区吉祥院宮ノ東町２５番地) filed a patent application (PCT/JP2025/016306) for "BONDING STATE INSPECTION DEVICE AND BONDING STATE INSPECTION METHOD" on Apr 30, 2025. With publication no. WO/2025/239203, the details related to the patent application was published on Nov 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Prop...