GENEVA, Sept. 30 -- BONDTECH CO., LTD. (25, Kisshoin-Miyanohigashi-cho, Minami-ku, Kyoto-shi, Kyoto6018305), ボンドテック株式会社 (京都府京都市南区吉祥院宮ノ東町２５番地) filed a patent application (PCT/JP2025/010381) for "BONDING METHOD AND BONDING SYSTEM" on Mar 18, 2025. With publication no. WO/2025/197893, the details related to the patent application was published on Sep 25, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Invent...