INTERNATIONAL PATENT: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM FILES APPLICATION FOR "METHODS FOR DIE-TO-WAFER AND WAFER-TO-WAFER BONDING"

GENEVA, Jan. 20 -- BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (210 West 7th StreetAustin, TX 78701) filed a patent application (PCT/US2025/037088) for "METHODS FOR DIE-TO-WAFER AND WAFER-TO-WAFER BONDING" on Jul 10, 2025. With publication no. WO/2026/015698, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SREENIVASAN, Sidlgata V. (c/o The University of Texas at AustinMER 1.206, 10100 Burnet Road, Bldg. 160Austin, TX 78758-4445), SHAH, Jay (c/o The University of Texas at AustinMER 1.206, 10100 Burnet Road, Bldg. 160A...