INTERNATIONAL PATENT: BINDING.CO.,LTD, 주식회사 바인딩 FILES APPLICATION FOR "METHOD FOR MANUFACTURING TRANSPARENT CIGS MODULE AND TRANSPARENT CIGS MODULE MANUFACTURED USING SAME"

GENEVA, June 11 -- BINDING.CO.,LTD (3-dong,4 Techno 2-roYuseong-gu,Daejeon 34015), 주식회사 바인딩 (대전광역시유성구테크노2로 4, 3동) filed a patent application (PCT/KR2024/019237) for "METHOD FOR MANUFACTURING TRANSPARENT CIGS MODULE, AND TRANSPARENT CIGS MODULE MANUFACTURED USING SAME" on Nov 29, 2024. With publication no. WO/2025/116592, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KIM, Sung Yong (...