GENEVA, June 17 -- BESTPACK CO., LTD. (2-4-3 Iwamoto-cho, Chiyoda-ku, Tokyo1010032), ベストパック株式会社 (東京都千代田区岩本町二丁目４番３号) filed a patent application (PCT/JP2024/041704) for "PRIMARY PACKAGING MACHINE" on Nov 26, 2024. With publication no. WO/2025/121194, the details related to the patent application was published on Jun 12, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TOMIYAMA Kenichi (c/o Bestpack Co., Ltd.,...