INTERNATIONAL PATENT: BERICAP INC., AMCOR RIGID PACKAGING USA, LLC FILES APPLICATION FOR "FLAME MITIGATION CLOSURE ASSEMBLY"

GENEVA, Nov. 4 -- BERICAP INC. (835 Syscon CourtBurlington, Ontario L7L 6C5), AMCOR RIGID PACKAGING USA, LLC (935 Technology DriveAnn Arbor, Michigan 48108) filed a patent application (PCT/US2024/026016) for "FLAME MITIGATION CLOSURE ASSEMBLY" on Apr 24, 2024. With publication no. WO/2025/226265, the details related to the patent application was published on Oct 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BIRKETT, Christopher (8 Buccaneer Way, East YorkshireBrough HU15 1EW), SUN, Peng (5593 Cortina CresMississauga, Ontario L4Z 3R3), LEE, Ryan (17 Division St.Acton, Ontario L7J 2R2), ...