INTERNATIONAL PATENT: BENDPAK, INC. FILES APPLICATION FOR "HEATER MODULE"

GENEVA, April 30 -- BENDPAK, INC. (30440 Agoura RoadAgoura Hills, CA 91301) filed a patent application (PCT/US2024/052076) for "HEATER MODULE" on Oct 18, 2024. With publication no. WO/2025/085820, the details related to the patent application was published on Apr 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FRANKLIN, Larry L. (2912 Patina CourtCamarillo, CA 93010), KRITZER, Jeffrey S. (11258 Watson DriveMoorpark, CA 93021)

Abstract: A heating module includes a securement flange, a central frame, and a front cover. The securement flange includes an annular sidewall configured to be ...