INTERNATIONAL PATENT: BEIJING SILICARISE TECH CO., LTD., 北京硅升科技有限公司 FILES APPLICATION FOR "CHIP PACKAGING BODY, WORKING ASSEMBLY AND COMPUTING DEVICE"

GENEVA, June 2 -- BEIJING SILICARISE TECH CO., LTD. (Room 101, 20th Floor, Building 1, Yard 1, No. 81 Beiqing RoadHaidian District, Beijing 100094), 北京硅升科技有限公司 (中国北京市海淀区北清路81号院一区1号楼20层101) filed a patent application (PCT/CN2024/119038) for "CHIP PACKAGING BODY, WORKING ASSEMBLY AND COMPUTING DEVICE" on Sep 14, 2024. With publication no. WO/2025/107848, the details related to the patent application was published on May 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is manage...