INTERNATIONAL PATENT: BANSAL, HARGOVIND PRASAD FILES APPLICATION FOR "MULTI-SEALED PACKAGING SYSTEM AND PACKAGING MATERIAL FOR PRODUCTS SENSITIVE TO ENVIRONMENTAL CONDITIONS"

GENEVA, Nov. 10 -- BANSAL, Hargovind Prasad (Shri Vardhman Flora, Flat B5-202, Sector- 90, Haryana, IndiaGurugram 122505) filed a patent application (PCT/IB2025/054285) for "MULTI-SEALED PACKAGING SYSTEM AND PACKAGING MATERIAL FOR PRODUCTS SENSITIVE TO ENVIRONMENTAL CONDITIONS" on Apr 24, 2025. With publication no. WO/2025/229465, the details related to the patent application was published on Nov 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BANSAL, Hargovind Prasad (Shri Vardhman Flora, Flat B5-202, Sector- 90, Haryana, IndiaGurugram 122505)

Abstract: The present invention relates to...