GENEVA, Feb. 17 -- BANDAI CO., LTD. (4-8, Komagata 1-chome, Taito-ku, Tokyo1118081), 株式会社バンダイ (東京都台東区駒形一丁目４番８号) filed a patent application (PCT/JP2025/024721) for "CONFECTION" on Jul 09, 2025. With publication no. WO/2026/034115, the details related to the patent application was published on Feb 12, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MIYAWAKI Jun (c/o BANDAI CO., LTD. 4-8, Komagata 1-chome, Taito-ku, Tokyo1118081), ê...