INTERNATIONAL PATENT: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. FILES APPLICATION FOR "PICK AND PLACE FABRICATION USING THIN FILM COMPONENTS"

GENEVA, Feb. 18 -- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. (P.O. Box 868, NHQ1-719Nashua, New Hampshire 03061-0868) filed a patent application (PCT/US2025/040819) for "PICK AND PLACE FABRICATION USING THIN FILM COMPONENTS" on Aug 06, 2025. With publication no. WO/2026/035789, the details related to the patent application was published on Feb 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WYCKOFF, Nathaniel P. (PO Box 868, NHQ1-719Nashua, New Hampshire 03061-0868), WARREN, Alexander S. (PO Box 868, NHQ1-719Nashua, New Hampshire 03061-0868), TERRY, Benjamin (PO Box...