GENEVA, Oct. 12 -- AUTOCHIPS INC. (10F Building A3, Innovation Industrial Park, No. 800 West Wangjiang RoadHefei, Anhui 230000), 合肥杰发科技有限公司 (中国安徽省合肥市望江西路800号创新产业园A3楼10层) filed a patent application (PCT/CN2024/104731) for "FUNCTIONAL MODULE ACCESS METHOD, ELECTRONIC DEVICE, STORAGE MEDIUM, AND PROGRAM PRODUCT" on Jul 10, 2024. With publication no. WO/2025/208730, the details related to the patent application was published on Oct 09, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC)...