INTERNATIONAL PATENT: AUROS TECHNOLOGY, INC., 주식회사 오로스테크놀로지 FILES APPLICATION FOR "ALIGNMENT MARK USED IN WAFER BONDING PROCESS AND WAFER BONDING METHOD USING SAME"

GENEVA, May 27 -- AUROS TECHNOLOGY, INC. (15-23, Dongtansandan 6-gil,Hwaseong-si,Gyeonggi-do 18487), 주식회사 오로스테크놀로지 (경기도화성시동탄산단6길 15-23) filed a patent application (PCT/KR2024/011020) for "ALIGNMENT MARK USED IN WAFER BONDING PROCESS AND WAFER BONDING METHOD USING SAME" on Jul 29, 2024. With publication no. WO/2025/105645, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Invento...