INTERNATIONAL PATENT: ATOTECH DEUTSCHLAND GMBH & CO. KG FILES APPLICATION FOR "ELECTROLESS, NICKEL-FREE COPPER PLATING SOLUTION AND METHOD USING THE SOLUTION"

GENEVA, May 5 -- ATOTECH DEUTSCHLAND GMBH & CO. KG (ErasmusstraBe 2010553 Berlin) filed a patent application (PCT/EP2024/080188) for "ELECTROLESS, NICKEL-FREE COPPER PLATING SOLUTION AND METHOD USING THE SOLUTION" on Oct 25, 2024. With publication no. WO/2025/088097, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BREMMERT, Stefanie (c/o Atotech Deutschland GmbH & Co. KGIntellectual PropertyErasmusstraBe 2010553 Berlin), GREGORIADES, Laurence John (c/o Atotech Deutschland GmbH & Co. KGIntellectual PropertyErasmusstraBe 20...