INTERNATIONAL PATENT: ATOTECH DEUTSCHLAND GMBH & CO. KG FILES APPLICATION FOR "A METHOD FOR ELECTROLESS COPPER DEPOSITING ONTO A SURFACE OF A NON-CONDUCTIVE OR CARBONFIBRES CONTAINING SUBSTRATE"

GENEVA, Oct. 4 -- ATOTECH DEUTSCHLAND GMBH & CO. KG (ErasmusstraBe 2010553 Berlin) filed a patent application (PCT/EP2025/057944) for "A METHOD FOR ELECTROLESS COPPER DEPOSITING ONTO A SURFACE OF A NON-CONDUCTIVE OR CARBONFIBRES CONTAINING SUBSTRATE" on Mar 24, 2025. With publication no. WO/2025/202100, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GREGORIADES, Laurence John (c/o Atotech Deutschland GmbH & Co. KGIntellectual PropertyErasmusstraBe 2010553 Berlin), WELZ, Yvonne (c/o Atotech Deutschland GmbH & Co. KGIntell...