GENEVA, June 30 -- ASML NETHERLANDS B.V. (P.O. Box 3245500 AH Veldhoven) filed a patent application (PCT/EP2024/083255) for "SYSTEM AND METHOD FOR STRESS RELEASE IN DIE BONDING" on Nov 22, 2024. With publication no. WO/2025/131544, the details related to the patent application was published on Jun 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): VAN DEN BRINK, Marinus, Aart (P.O. Box 3245500 AH Veldhoven), BEUKMAN, Arjan, Johannes, Anton (P.O. Box 3245500 AH Veldhoven), SOKOLOV, Sergei (P.O. Box 3245500 AH Veldhoven)
Abstract:
A system comprising: a targeted emission system configured ...