GENEVA, Nov. 17 -- ASML NETHERLANDS B.V. (P.O. Box 3245500 AH Veldhoven) filed a patent application (PCT/EP2025/058984) for "SYSTEM AND METHOD FOR DIE BONDING WITH DIFFRACTION BASED ALIGNMENT MARKS ON THE DIE" on Apr 02, 2025. With publication no. WO/2025/233063, the details related to the patent application was published on Nov 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DE JAGER, Pieter, Willem, Herman (P.O. Box 3245500 AH Veldhoven), SCHOUTEN, Christine, Henriette (P.O. Box 3245500 AH Veldhoven), DOLK, Victor, Sebastiaan (P.O. Box 3245500 AH Veldhoven), WAHBEH, Lotfi (P.O. Box 324...