GENEVA, Dec. 15 -- ASML NETHERLANDS B.V. (P.O. Box 3245500 AH Veldhoven) filed a patent application (PCT/EP2025/062056) for "SYSTEM AND METHOD FOR DIE BONDING SELF-ALIGNMENT" on May 02, 2025. With publication no. WO/2025/252364, the details related to the patent application was published on Dec 11, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): DE JAGER, Pieter, Willem, Herman (P.O. Box 3245500 AH Veldhoven), VENUGOPALAN, Syam, Parayil (P.O. Box 3245500 AH Veldhoven), ASSENDELFT, Joep (P.O. Box 3245500 AH Veldhoven)
Abstract: Existing die-to-wafer bonding tools use guided alignment to posi...