INTERNATIONAL PATENT: ASML NETHERLANDS B.V. FILES APPLICATION FOR "SUBSTRATE COUPLING SYSTEMS"

GENEVA, March 31 -- ASML NETHERLANDS B.V. (P.O. Box 3245500 AH Veldhoven) filed a patent application (PCT/EP2024/073055) for "SUBSTRATE COUPLING SYSTEMS" on Aug 16, 2024. With publication no. WO/2025/061386, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HSU, Chia-Hao (P.O. Box 3245500 AH Veldhoven)

Abstract: Current substrate (e.g., semiconductor wafer) coupling (e.g., bonding) process control methodology uses measured substrate flatness and shape to control the coupling process. Current equipment configurations and ...