GENEVA, Oct. 4 -- ASML NETHERLANDS B.V. (P.O. Box 3245500 AH Veldhoven) filed a patent application (PCT/EP2025/055281) for "METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES" on Feb 27, 2025. With publication no. WO/2025/201786, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): HSU, Chia-Hao (P.O. Box 3245500 AH Veldhoven), WOLTGENS, Pieter, Joseph, Marie (P.O. Box 3245500 AH Veldhoven)
Abstract: Disclosed is a method of bonding a first semiconductor substrate to a second semiconductor substrate, the method comprising: providing...