GENEVA, Feb. 8 -- ASML NETHERLANDS B.V. (P.O. Box 3245500 AH Veldhoven) filed a patent application (PCT/EP2025/067505) for "METHOD AND APPARATUS FOR BONDING SUBSTRATES" on Jun 23, 2025. With publication no. WO/2026/027129, the details related to the patent application was published on Feb 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): HSU, Chia-Hao (P.O. Box 3245500 AH Veldhoven), NIKIPELOV, Andrey (P.O. Box 3245500 AH Veldhoven)
Abstract: Disclosed is a method of bonding a first substrate to a second substrate, the first substrate comprising a first bonding surface and first electrica...