GENEVA, Feb. 8 -- ASML NETHERLANDS B.V. (P.O. Box 3245500 AH Veldhoven) filed a patent application (PCT/EP2025/069403) for "MACHINE-LEARNING ASSISTED EXTRAPOLATION OF WAFER-SCALE METROLOGY USING ALIGNMENT READ-OUTS" on Jul 08, 2025. With publication no. WO/2026/027188, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KRIEGER, Annika Meike (P.O. Box 3245500 AH Veldhoven), BATISTAKIS, Chrysostomos (P.O. Box 3245500 AH Veldhoven)

Abstract: A non-transitory computer readable medium that stores a set of instructions that is ex...