INTERNATIONAL PATENT: ASML NETHERLANDS B.V. FILES APPLICATION FOR "APPARATUS AND METHOD FOR MULTI-STAGE DIE BONDING"

GENEVA, June 30 -- ASML NETHERLANDS B.V. (P.O. Box 3245500 AH Veldhoven) filed a patent application (PCT/EP2024/083262) for "APPARATUS AND METHOD FOR MULTI-STAGE DIE BONDING" on Nov 22, 2024. With publication no. WO/2025/131545, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DE JAGER, Pieter, Willem, Herman (P.O. Box 3245500 AH Veldhoven), SCHOUTEN, Christine, Henriette (P.O. Box 3245500 AH Veldhoven), DOLK, Victor, Sebastiaan (P.O. Box 3245500 AH Veldhoven), WAHBEH, Lotfi (P.O. Box 3245500 AH Veldhoven), ASSENDELFT, Joe...