GENEVA, June 23 -- ASML NETHERLANDS B.V. (P.O. Box 3245500 AH Veldhoven) filed a patent application (PCT/EP2024/082529) for "A DISTRIBUTED SYSTEM FOR WAFER PRINT CHECK" on Nov 15, 2024. With publication no. WO/2025/124833, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WANG, Fuming (80 W Tasman DriveSan Jose, California 95134)

Abstract: A method for performing a distributed wafer print check includes: inspecting a zone of a full field of a first wafer by a first inspection tool; determining defect locations in the zon...