INTERNATIONAL PATENT: ASAHI KASEI KABUSHIKI KAISHA, 旭化成株式会社 FILES APPLICATION FOR "RESIN COMPOSITION, CURED PRODUCT, STRUCTURE, CURING AGENT, SEALING MATERIAL, ADHESIVE, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE"

GENEVA, Jan. 27 -- ASAHI KASEI KABUSHIKI KAISHA (1-1-2 Yurakucho, Chiyoda-ku, Tokyo1000006), 旭化成株式会社 (東京都千代田区有楽町一丁目１番２号) filed a patent application (PCT/JP2025/024802) for "RESIN COMPOSITION, CURED PRODUCT, STRUCTURE, CURING AGENT, SEALING MATERIAL, ADHESIVE, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE" on Jul 10, 2025. With publication no. WO/2026/018767, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is mana...