INTERNATIONAL PATENT: ARM LIMITED FILES APPLICATION FOR "DIE-TO-DIE COMMUNICATION"

GENEVA, Feb. 10 -- ARM LIMITED (110 Fulbourn RoadCambridgeCambridgeshire CB1 9NJ) filed a patent application (PCT/GB2024/051484) for "DIE-TO-DIE COMMUNICATION" on Jun 10, 2024. With publication no. WO/2025/027265, the details related to the patent application was published on Feb 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HERBERHOLZ, Rainer (c/o Arm Limited110 Fulbourn RoadCambridge Cambridgeshire CB1 9NJ), TUNE, Andrew David (c/o Arm LimitedCity Gate8 St Mary's GateSheffield S1 4LW)

Abstract: A semiconductor die device comprises a die-to-die communication module (104) for commun...