INTERNATIONAL PATENT: ARIECA INC. FILES APPLICATION FOR "THERMAL INTERFACE MATERIALS COMPRISING LIQUID METAL DROPLETS AND SOLID THERMALLY CONDUCTIVE PARTICLES, CIRCUIT ASSEMBLIES FORMED THEREFROM AND METHODS OF MANUFACTURE THEREOF"

GENEVA, June 24 -- ARIECA INC. (201 N. Braddock Ave., STE 334Pittsburgh, Pennsylvania 15208) filed a patent application (PCT/US2024/047946) for "THERMAL INTERFACE MATERIALS COMPRISING LIQUID METAL DROPLETS AND SOLID THERMALLY CONDUCTIVE PARTICLES, CIRCUIT ASSEMBLIES FORMED THEREFROM, AND METHODS OF MANUFACTURE THEREOF" on Sep 23, 2024. With publication no. WO/2025/128172, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FELLER, Keyton D. (3920 Hoosac Street, Apt. 1Pittsburgh, Pennsylvania 15207), MONDAL, Swagata (100 Bryn ...