INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "USE OF ALTERNATING LAYER PATTERNS APPROACH FOR EFFECTIVE OVERLAY METROLOGY IN MULTI-STACK DIE APPLICATIONS"

GENEVA, April 21 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2024/050553) for "USE OF ALTERNATING LAYER PATTERNS APPROACH FOR EFFECTIVE OVERLAY METROLOGY IN MULTI-STACK DIE APPLICATIONS" on Oct 09, 2024. With publication no. WO/2025/080698, the details related to the patent application was published on Apr 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHONG, Yau Loong (c/o Applied Materials South East Asia Pte. Ltd.8 Upper Changi Road NorthSingapore 506906), VOLETI, Venkatakaushik (c/o Applied Materials, Inc., Law Dept....