INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "THERMALLY AND ELECTRICALLY CONDUCTIVE ADHESIVE FOR GROUNDING AND THERMAL GAP FILLING OF ELECTRODES"

GENEVA, Dec. 2 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/024168) for "THERMALLY AND ELECTRICALLY CONDUCTIVE ADHESIVE FOR GROUNDING AND THERMAL GAP FILLING OF ELECTRODES" on Apr 10, 2025. With publication no. WO/2025/244756, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): STEARNS, Michael A. (c/o Applied Materials, Inc., Law Dept., M/S 12693050 Bowers AvenueSanta Clara, California 95054), WONG, Carlaton (c/o Applied Materials, Inc., Law Dept., M/S 12...