GENEVA, Oct. 6 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/019281) for "SILICON ETCH BYPRODUCT REMOVAL" on Mar 11, 2025. With publication no. WO/2025/207307, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SHERPA, Sonam Dorje (c/o Applied Materials, Inc., Law Dept., M/S 12693050 Bowers AvenueSanta Clara, California 95054), CHO, Han Soo (c/o Applied Materials, Inc., Law Dept., M/S 12693050 Bowers AvenueSanta Clara, California 95054), RANJAN, Alok (c/o ...