INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "SEMICONDUCTOR WAFER PROCESSING WITH ELECTROMAGNETIC PLASMA CONFINEMENT"

GENEVA, Feb. 10 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/034611) for "SEMICONDUCTOR WAFER PROCESSING WITH ELECTROMAGNETIC PLASMA CONFINEMENT" on Jun 20, 2025. With publication no. WO/2026/029877, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SARODE VISHWANATH, Yogananda (c/o Applied Materials India Private Ltd.Unit 5, 3rd Fl., Explr Bldg, Whitefield Rd.Bangalore 560066), POULOSE, John (c/o Applied Materials, Inc., Law Dept., M/S 12693050 Bowers A...