INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "SELF-ALIGNED BOTTOM DIELECTRIC ISOLATION FOR BACKSIDE POWER DELIVERY"

GENEVA, Jan. 20 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/030277) for "SELF-ALIGNED BOTTOM DIELECTRIC ISOLATION FOR BACKSIDE POWER DELIVERY" on May 20, 2025. With publication no. WO/2026/015209, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEE, Byeong Chan (c/o Applied Materials, Inc., Law Dept., M/S 12693050 Bowers AvenueSanta Clara, California 95054)

Abstract: A method of forming a portion of a gate-all-around field-effect transistor (GAA FET)...