INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "METHODS FOR REDUCING PHOTORESIST AND CARBON ETCH RATES IN AN ICP PROCESS CHAMBER USING A SILICON-BASED CHAMBER PRE-COAT"

GENEVA, June 24 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2024/055381) for "METHODS FOR REDUCING PHOTORESIST AND CARBON ETCH RATES IN AN ICP PROCESS CHAMBER USING A SILICON-BASED CHAMBER PRE-COAT" on Nov 11, 2024. With publication no. WO/2025/128253, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHERPA, Sonam Dorje (c/o Applied Materials, Inc., Law Dept., M/S 12693050 Bowers AvenueSanta Clara, California 95054), RANJAN, Alok (c/o Applied Materials, Inc...