INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "METHODS FOR BONDING SEMICONDUCTOR SUBSTRATES"

GENEVA, Oct. 20 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/018141) for "METHODS FOR BONDING SEMICONDUCTOR SUBSTRATES" on Mar 03, 2025. With publication no. WO/2025/216817, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): JEON, Yoocharn (3333 Scott Blvd.Santa Clara, California 95054)

Abstract: Methods for preparing a substrate and bonding two substrates together which include a bonding layer disposed directly over and in contact with a barrier layer i...