INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "METHOD AND APPARATUS FOR SUBSTRATE NOTCH SENSING ON CMP HEAD FOR LOCAL PLANARIZATION"

GENEVA, Aug. 26 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/015233) for "METHOD AND APPARATUS FOR SUBSTRATE NOTCH SENSING ON CMP HEAD FOR LOCAL PLANARIZATION" on Feb 10, 2025. With publication no. WO/2025/174692, the details related to the patent application was published on Aug 21, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CJ, Balasubramaniam (c/o Applied Materials India Private LimitedMayflower Signature, Module A & C, 6th Floor#531/537, Avinashi Road, Peelamedu CoimbatoreTamilnadu 641004)

Abstract: Embodiment...