INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "INTEGRATED WET PASSIVATION ON CMP FOR HYBRID BONDING POST-CU PAD POLISH CAPPING"

GENEVA, Dec. 2 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/026747) for "INTEGRATED WET PASSIVATION ON CMP FOR HYBRID BONDING POST-CU PAD POLISH CAPPING" on Apr 29, 2025. With publication no. WO/2025/244795, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WEI, Tsung Shang (c/o Applied Materials Taiwan; Ltd.No 32, R&D Road II; Hsinchu Science ParkHsinchu, 30009), GOH, Zheng Da Clinton (c/o Applied Materials South East Asia Pte. Ltd.8 Upper Changi Road N...