INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "INDUCTIVE SENSOR INTERFACE FOR ON-WAFER PLATING THICKNESS MEASUREMENTS"

GENEVA, Jan. 27 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSANTA CLARA, California 95054-3299) filed a patent application (PCT/US2025/030833) for "INDUCTIVE SENSOR INTERFACE FOR ON-WAFER PLATING THICKNESS MEASUREMENTS" on May 23, 2025. With publication no. WO/2026/019485, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MCSHANE, Carl X. (c/o Bowers AvenueSANTA CLARA, California 95054-3299)

Abstract: A sensor interface configured to determine a thickness of plating on a wafer, including an inductance to digital converte...