GENEVA, Oct. 6 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/013588) for "IN-LINE VALIDATION OF SUBSTRATE BONDING SURFACE" on Jan 29, 2025. With publication no. WO/2025/207195, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): WOZNY, Sarah (9700 US HWY 290 EastAustin, Texas 78724), BERNT, Marvin Louis (Applied Materials PPC655 West Reserve DriveKalispell, Montana 59901)
Abstract: An integrated bonder system for processing a substrate is provided, The sys...