INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "GROUNDING PLATE FOR STRESS TUNING HIGH DENSITY AND MODULUS FILMS"

GENEVA, Oct. 6 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/021491) for "GROUNDING PLATE FOR STRESS TUNING HIGH DENSITY AND MODULUS FILMS" on Mar 26, 2025. With publication no. WO/2025/207735, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEE, Soonil (c/o Applied Materials, Inc., Law Dept., M/S 1269; 3050 Bowers AvenueSanta Clara, California 95054), MALLICK, Abhijit Basu (c/o Applied Materials, Inc., Law Dept., M/S 1269; 3050 Bowers AvenueSanta Clara...