INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "FLOW-THROUGH EDGE SHIELD TO LESSEN CURRENT CROWDING EFFECTS DURING WAFER ELECTROPLATING"

GENEVA, June 18 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2024/056626) for "FLOW-THROUGH EDGE SHIELD TO LESSEN CURRENT CROWDING EFFECTS DURING WAFER ELECTROPLATING" on Nov 20, 2024. With publication no. WO/2025/122348, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WILSON, Gregory J. (c/o 3050 Bowers AvenueSanta Clara, California 95054), MCHUGH, Paul R. (c/o 3050 Bowers AvenueSanta Clara, California 95054)

Abstract: An edge shield for reducing electr...