INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "FINISHING ON PACKAGING SUBSTRATE WITH ULTRA HIGH-DENSITY INTERCONNECTS"

GENEVA, Sept. 10 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/017981) for "FINISHING ON PACKAGING SUBSTRATE WITH ULTRA HIGH-DENSITY INTERCONNECTS" on Feb 28, 2025. With publication no. WO/2025/184601, the details related to the patent application was published on Sep 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): VERHAVERBEKE, Steven (3050 Bowers AvenueSanta Clara, California 95054), CHEN, Han-Wen (3050 Bowers AvenueSanta Clara, California 95054), PARK, Giback (3050 Bowers AvenueSanta Clara, California 95054), ZHENG,...