GENEVA, Oct. 1 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/020204) for "EXTERNAL COOLING ASSEMBLY FOR SUBSTRATE SUPPORT" on Mar 17, 2025. With publication no. WO/2025/199017, the details related to the patent application was published on Sep 25, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): HUDERI SOMANNA, Dinkesh (3320 Scott BoulevardSanta Clara, California 95054), DEYO, Dan (115 Bluejack PlaceAustin, Texas 78613)
Abstract: Embodiments of cooling assemblies for substrate supports are provided herein. In some embodime...